SemiconductorTALENT.com, a division of Intelligent Technology Solutions,
is a North American leader in providing executive search services to the
microelectronics and engineering sectors
Sr. Package Design Engineer -High Speed Analog / Mixed-Signal ICs
Relocation -YES
Location - Greater Los Angeles Area
Responsibilities:
- Package Design Engineer for growing line of products for telecom,
datacom, computing and test and measurement applications.
Requirements:
- BSEE or 5+ years of industry experience with design of packages for high
speed analog / mixed-signal Ics
- Proven track record of package development from concept to production
- Strong fundamentals of transmission lines, EM, and microwave theory;
- Experience designing and simulating power delivery networks for digital
and analog ICs
- Experience in designing for manufacturability with High Vol in mind
- Knowledge of the following:
Packaging technologies
Materials
Package substrate design rules
Assembly rules
- Experience with VNA and TDR measurements for package characterization
- Experience with measurements and/or simulation-based model extraction
- Strong working knowledge of EM simulation tools: HFSS / IE3D / SI-Wave /
Momentum
- Working knowledge of circuit design tools: Spectre / ADS
- Familiarity with layout and CAD tools: APD / PADS / AutoCAD
Desirables:
- Layout experience (APD, PADS) is a big plus
Location : Los Angeles, CA
Perm/Contract : Permanent
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www.intelligentinc.com/conf_policy.asp
About SemiconductorTALENT.com
SemiconductorTALENT.com, a division of Intelligent Technology Solutions,
is a highly specialized and successful recruitment agency. We represent
excellent, well-funded pre-IPO and leading public companies all across
North America. Our clients are industry leaders who develop advanced
technologies for semiconductor, video / graphics / imaging, wireless, and
networking / communications markets.
Be sure to quote : Sr. Package Design Engineer -High Speed Analog /
Mixed-Signal Ics (Project # 5489)
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