Subject: Ref:n.14348 - Packaging, IC Production, to 35k, Cambridge, UK
Our client are looking for a Materials Specialist to work on the
complex electronics, mechanical and production issues of interfacing
between the bare silicon die and the electronic product in which it is
used.
The role encomp***** multiple functions focused on sup****ting the
current packaging technologies and the introduction of new ones, to
sup****t our client's growing product range. The current package range
includes WLCSP, BGA, LGA and multi-chip module packages, so the
candidate will need an understanding of chip and wire assembly, SMT,
flip-chip, thin-film processing, and semiconductor packaging related
polymer chemistry and metallurgy.
Part of the role will include providing technical advice to customers.
The candidate will assist with the development and introduction of new
package designs, which will include resolving package-related
problems.
An electronics graduate, you will have 3-5 years' experience in
packaging in a high volume, mixed-signal IC production environment.
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For further information on ECM and to search our ONLINE VACANCY DATABASE
visit http://www.ecmsel.co.uk
Please contact us by Email: topjob@[EMAIL PROTECTED]
Snail, Fax or Phone:
ECM Selection Ltd, The Maltings, Burwell, Cambridge, CB5 0HB
Phone: 01638 742244 FAX: 01638 743066
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